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专利名称：Integrated circuit packages and the method
for the same
发明人：Kai-Kuang Ho,Te-Sheng Yang,Charlie Han申请号：US097747申请日：20010131公开号：US06545350B2公开日：20030408
专利附图：
摘要：This invention relates to a method and a means for packaging integratedcircuits, especially relates to a heat sink in the operating integrated circuit packages. Theheat sink is bonded on the lead frame by a tap and take advantage of the length
between the heat sink and the first mold packaged materials at the first axis to be aboutequal to the length between the chip and the second mold packaged materials at thefirst axis to prevent producing voids form unbalanceable thermal mold flow. The heatsink can also dissipating heat from the lead frame to others spaces in the integratedcircuit packages. This method and means can prevent delaminating and crackingoccurring in the chip and increasing the qualities in integrated circuits.
申请人：UNITED MICROELECTRONICS CORP.
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